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Genius H20 BGEBE Computing Platform

The ​​Genie H20 Series​​ is an ultra-thin, high-performance computing platform designed for:
​​AGV/AMR Mobile Robots​​ (navigation control, swarm scheduling)
​​Machine Vision​​ (industrial inspection, real-time 3D recognition)
​​Edge AI Computing​​ (behavioral analytics, predictive maintenance)
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  • Genius H20 BGEBE

1. Modular CPU Computing Platform

The Genie Series CPUs adopt a modular design, flexibly supporting Intel 12th Gen Alder Lake-U, 11th Gen Tiger Lake-U, 8th Gen Whiskey Lake-U Core i7/i5/i3 processors, as well as 6th/7th Gen SkyLake-U/KabyLake-U Core i7/i5/i3 and Celeron J1900.


2. Modular I/O Interfaces: Multi-Network, Multi-Serial, Customizable

• Genie Series I/O interfaces feature configurable modular design

• It supports 4-6 Ethernet ports for machine vision camera communication

• It enables EtherCAT bus motion control and communication with up to 10 RS-232/485 devices

• DIO digital I/O and CAN bus can be flexibly configured


3. High-Precision Die-Cast Aluminum with Copper-Aluminum Integrated Heat Dissipation

• The compact and rugged Genie Series utilizes die-cast aluminum unibody construction. Through thermal simulations across 10+ CPU power profiles, it achieves integrated heat pipe cooling technology that solves industry pain points, ensuring stable and reliable high-performance computing in tight spaces.


4. UPS Backup Battery for Data Security

• Optional UPS battery management automatically prioritizes data preservation during unexpected power outages. Configurable 3-10 minute countdown auto-shutdown ensures complete protection for critical production data, hard drives, software, and OS - significantly enhancing device stability and real-time operation reliability.


5. Cable-Free Design for Enhanced Reliability

• Reliability lies in details: Genie Series I/O interfaces use direct physical connections without cables, minimizing impacts from vibration, mobile operation, transportation, and poor cable connections. This eliminates external environmental factors to ensure highly efficient production.


6. Single-Side I/O & Modular Installation

• Genie Series offers unique single-side I/O and multiple mounting options. Compared to traditional dual-I/O hosts, the single-side design simplifies installation in compact spaces and streamlines field communication debugging.

• With flexible embedded/DIN rail mounting options, it is the ideal choice for AGV robot control systems and machine vision applications - effectively addressing challenges in modular computing performance, modular I/O interfaces, and customization requirements in space-constrained environments.


7. Localized Upgrades & Wireless Data Networking

• The Genie Series features removable hard drives for user-driven capacity upgrades, simplifying local maintenance while significantly reducing downtime and costs.

• In the IoT era, it enables edge computing with seamless wireless networking (4G/5G/WiFi/Bluetooth), unlocking big data value for smart factories in industrial IoT applications.


  1. It supports Intel 10th/11th/12th/13th Gen Core i7/i5/i3 mobile computing platforms

  2. CPU: Up to 12 cores/16 threads @ 5.0GHz, 18MB L3 cache

  3. 4 independent LAN ports, 1 serial port with 3KV optocoupler isolation and 2KV surge protection, HDMI, optional VGA

  4. Optional 6 serial ports (1 isolated RS-232/485/422, 2 RS-232/485, 3 RS-232)

  5. Optional dual CAN interfaces (up to 1Mbps), supporting CAN 2.0, SocketCAN, and CANopen protocols

  6. USB 3.0×4, USB 2.0×2 (optional)

  7. 24V DC power input with reverse connection protection, over-voltage protection, and auto-restart functionality

  8. Dedicated aviation-grade vehicle power connector ensures reliable power delivery in mobile environments

  9. OS: Ubuntu 18.04/20.04, Windows 10, Windows 11, etc.

  10. Mounting options: Embedded or DIN rail

  11. Dimensions: 200(W) × 135(H) × 44(D) mm

  12. Applications: AGV/AMR mobile robots, machine vision, AI computing, and related fields


AGV/AMR Mobile Robots (navigation control, swarm scheduling)

Machine Vision (industrial inspection, real-time 3D recognition)

Edge AI Computing (behavioral analytics, predictive maintenance)


Frequent Questions
  • 1. How does the ultra-thin design achieve high performance?​​
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    形状 Created with Sketch.
    Through a sandwich architecture:
    ​​Top layer​​: Intel® Core™ i7-12800H (14 cores/5.0GHz) + 32GB LPDDR5
    ​​Middle layer​​: Dual-sided cooling module
    ​​Bottom layer​​: RTX 4060 Mobile GPU + 4× M.2 NVMe slots
  • 2. What are the breakthrough applications in machine vision scenarios?​​
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    Typical innovative cases include: 3D defect detection, dynamic grasping, and micron-level measurement.
  • 3. What mounting options are available?​​
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    形状 Created with Sketch.
    Rail-mounted and embedded.
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